AMD unveils G-Series X, hints at future ARM-based chips for embedded market

AMD announced its G-series embedded APUs this morning comprising three quad core parts and a couple of dual cores, four of them integrating Radeon HD 8000 grahics and an I/O module on a single piece of silicon. With power envelopes in the 9-25W range, the new chips are targeted at industrial control and automation, digital signage, gaming systems (they use the same Jaguar cores that power Sony’s PS4), SMB storage, IP-TV, set-top boxes and more.

While the chips themselves are noteworthy as AMD places an increased emphasis in the embedded market, Engadget points out another interesting tidbit that was left unmentioned in the press release. Namely, the inclusion of a small ‘X’ at the bottom right corner of the G-series logo, which the site has since been able to verify it stands for the x86 architecture as the company hints at future ARM-based variants that could be marked with an ‘A’.

AMD first announced plans for a highly-integrated, 64-bit ARM multicore System-on-a-Chip (SoC) for dense, energy-efficient servers back in October 2012 -- aiming for a 2014 release.

While in this case no specific ARM products have been announced, Arun Iyengar, AMD’s general manager for the embedded solutions group did confirm that “ultimately” they’ll have ARM in the product portfolio. This is the first time an ARM-Radeon combo has been suggested as a main application processor, which could mean the company is considering expanding its use of the architecture for low-power applications.

Wether they’ll eventually turn to ARM to finally break into the tablet segment remains to be seen. For now the company plans to attack this market with the 28nm “Temash” APU, which is set to replace the Hondo-based Z-Series offering double the graphics performance later this year.

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By: Unknown On 9:41 PM

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ARM sees 44 percent profit increase in Q1 2013, ships 2.6 billion ARM-based chips

ARM has had a great quarter -- again. This time it's seen pre-tax profits soar 44 percent, while revenues are up 26 percent (to $209.4 million) since the same period last year. The company's thanking the continued adoption of its low-power chip designs, encompassing smartphones, mobile computing and even digital TVs and wearable tech. The advanced tech within its ARMv8, Mali and big.LITTLE ranges has meant the company can command higher royalties per chip.

In total, 2.6 billion ARM-based chips have made their way into the gadgets this quarter, an increase of 35 percent year-on-year, with embedded hardware up a hefty 50 percent since Q1 2012. It's seen even better performance from its Mali graphics processor shipments, which are up five times since the same period last year. As outgoing CEO Warren East notes: "Even low cost smart devices can contain multiple ARM-based chips and be based on ARM's advanced Cortex-A series technology and Mali graphics processors." With new friends on board for the near-future, the good times are likely to continue.

Source: ARM

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By: Unknown On 6:19 PM

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AMD reveals G-Series X embedded chips, drops a little ARM-powered bombshell

AMD Targets High-Growth, Embedded Markets with New AMD Embedded G-Series System-on-Chip

High performance, energy-efficient quad-core x86 design fuels Surround Computing era

SAN JOSE, Calif., April 23, 2013 - DESIGN West - AMD (NYSE: AMD) today announced at DESIGN West the new AMD Embedded G-Series System-on-Chip (SOC) platform, a single-chip solution based on the AMD next-generation "Jaguar" CPU architecture and AMD Radeon™ 8000 Series graphics. The new AMD Embedded G-Series SOC platform further signifies a strategic push to focus on high-growth markets outside the PC industry, with an emphasis on embedded systems.

Embedded systems are increasingly driving intelligence into new areas of our lives across smart TVs and set-top-boxes to interactive digital signage and informational kiosks. This supports greater productivity and connectivity and is expected to be a strong driver for Surround Computing, an area of substantial growth in the computing industry. Among the forces that are enabling this next generation computing era are single-chip, SOC solutions that offer smaller size, higher performance and more energy efficient processors.
The AMD Embedded G-Series SOC platform sets the new bar for SOC design offers up to 113 percent improved CPU performance compared to the prior generation AMD Embedded G-Series APU, and up to 125 percent advantage compared to the Intel Atom when running multiple industry-standard compute intensive benchmarks.1 For embedded applications, the new platform also includes support for DirectX® 11.1, OpenGL 4.2x and OpenCL™ 1.22 that enable parallel processing and high-performance graphics processing, yielding up to 20 percent graphics improvement over the previous AMD Embedded G-Series APU and greater than 5x advantage over Intel Atom when running multiple industry-standard graphics-intensive benchmarks.

"We have built a treasure trove of industry-leading IP in processors, graphics and multimedia, along with the infrastructure to combine these building blocks into unsurpassed, embedded SOC solutions," said Arun Iyengar, vice president and general manager, AMD Embedded Solutions. "With a 33 percent smaller footprint 4, low power consumption and exceptional performance, the new AMD Embedded G-Series SOC sets the bar for content-rich, multimedia and traditional workload processing that is ideal for a broad variety of embedded applications."

The new processor family offers superior performance per watt in the low-power x86-compatible product category with 9W – 25W options5. It includes:
• enterprise-class Error-Correction Code (ECC) memory support,
• industrial temperature range of -40°C to +85°C and available with dual or quad-core CPUs,
• discrete-class AMD Radeon™ GPU, and
• I/O controller.

The AMD Embedded G-Series SOC combines dedicated resources that enable exceptional performance with shared resources to help reduce power consumption and die space, and provides developers the flexibility to leverage the same board design and software stack for a variety of applications due to the scalability of the new SOC design. The discrete-class graphics integrated into the AMD Embedded G-Series SOC power applications that previously required a separate graphics processor, while the addition of new CPU architecture for the Embedded G-Series SOC platform allows deeply embedded or "headless" systems, which are used in environments without a screen, monitor or input device and do not require a graphics solution.

"As the Internet of Things permeates every aspect of our life from work to home and everything where in-between, devices require high performance, I/O connectivity, and energy efficiency in smaller packages," said Colin Barnden, principal analyst, Semicast Research. "With this new AMD SOC design, the AMD Embedded G-Series platform offers the perfect mix of high performance, a small footprint, low-energy use, and full I/O integration to enable smaller form factor embedded designs, cool and efficient operation, and simplified build requirements. AMD has leapfrogged the competition by combining the power of an X86 CPU, and the performance of AMD Radeon graphics with the I/O interconnect all on a single die."

The AMD Embedded G-Series SOC supports Windows Embedded 8 and Linux, and is designed for myriad embedded applications including industrial control and automation, digital signage, electronic gaming systems, SMB storage, IP-TV, medical and network appliances, set-top-boxes and more. AMD will ship the AMD G-Series SOC platform with general availability in the second quarter of 2013, and target applications with a comprehensive ecosystem of industry-leading embedded solution providers supporting and/or announcing market-ready products powered by the AMD Embedded G-Series SOC.

Developer Support and Product Features:
Developers working with the AMD Embedded G-Series SOC can implement remote management, virtualization and security capabilities to help reduce deployment costs and increase security and reliability of their AMD Embedded G-Series SOC-based platform through:
• AMD DAS 1.0 featuring DASH 1.1
• AMD Virtualization™ technology
• Trusted Platform Module (TPM) 1.2 support

Next-generation CPU core
• Next-generation "Jaguar" core with innovative, new shared L2 Cache
• Enterprise-class feature of ECC and fast memory support

Excellent AMD Radeon™ graphics performance per watt
• Enhanced Universal Video Decode (UVD) 3 hardware acceleration (H.264, VC-1, MPEG2 etc.) and new video encode capability not available in previous AMD Embedded G-Series APU
• Power efficiency enhancement with clock gating to contribute to overall lower power consumption

Advanced GPU enables parallel processing and high-performance graphics
• Heterogeneous computing for industrial control and automation, communications and other processor heavy applications: OpenCL enables CPU and GPU parallel processing, which benefits applications development in these areas
• Graphics (DirectX 11, OpenGL) and dual independent display; high-resolution support for a superb visual experience
• Expands software development options and extends application lifetime with advanced graphics APIs

Ideal platform for low-power and high-performance designs
• For Industrial Control and Automation: low-power and heterogeneous computing advantage enabled by the integrated GPU deliver more than 150 GFLOPS of compute performance over and above the compute capability of the x86 CPU cores6
• For Digital Signage: eye-catching, high-definition multimedia content delivery connected through a variety of display technologies (DP, HDMI™, VGA, LVDS)
• For Electronic Gaming Machines: dedicated hardware acceleration engines for video decode (UVD) and encode (VCE) as well as digital content management (SAMU)
• For SMB storage: high-performance SOC in a small form factor with a myriad of integrated USB and SATA I/O enables a fan-less design, reducing system cost

Supporting Resources
• Visit the AMD Embedded G-Series SOC platform site
• Visit the AMD Embedded Solutions blog
• Watch a summary video about the AMD Embedded G-Series SOC
• Get technical support at the AMD Embedded Developer Support site
• For more AMD Embedded products, visit the AMD-Based Embedded Product Catalog

About AMD
AMD (NYSE: AMD) is a semiconductor design innovator leading the next era of vivid digital experiences with its ground-breaking AMD Accelerated Processing Units (APUs) that power a wide range of computing devices. AMD's server computing products are focused on driving industry-leading cloud computing and virtualization environments. AMD's superior graphics technologies are found in a variety of solutions ranging from game consoles, PCs to supercomputers. For more information, visit http://www.amd.com.

AMD, the AMD Arrow logo and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

AMD GX-415GA scored 209, AMD G-T56N scored 98, and Intel Atom D525 scored 93, based on an average of Sandra Engineering 2011 Dhyrstone, Sandra Engineering 2011 Whetstone and EEMBC CoreMark Multi-thread benchmark results. AMD G-T56N system configuration used iBase MI958 motherboard with 4GB DDR3 and integrated graphics. AMD GX-415GA system configuration used AMD "Larne" Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D525 system configuration used MSI MS-A923 motherboard with platform integrated 1GB DDR3 and integrated graphics. All systems running Windows® 7 Ultimate for Sandra Engineering and Ubuntu version 11.10 for EEMBC CoreMark. EMB-37

2 OpenCL 1.2 currently supported in the following operating systems: Microsoft Windows Vista; Microsoft Windows 7; Microsoft Windows Embedded Standard 7; Microsoft Windows 8 classic mode; Microsoft Windows Embedded Standard 8; Linux(Catalyst drivers). OpenGL 4.2 currently supported in the following operating systems: Microsoft Windows Vista; Microsoft Windows 7; Microsoft Windows Embedded Standard 7; Microsoft Windows 8 classic mode; Microsoft Windows Embedded Standard 8; Linux(Catalyst drivers). Ongoing support options TBA.

3 AMD GX-415GA scored 864, AMD G-T56N scored 724, and Intel Atom D525 scored 162, based on an average of 3DMark06 1280x1024 and PassMark Performance Test 7.0 2D Graphics Suite benchmark results. AMD G-T56N system configuration used iBase MI958 motherboard with 4GB DDR3 and integrated graphics. AMD GX-415GA system configuration used AMD "Larne" Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D525 system configuration used MSI MS-A923 motherboard with platform integrated 1GB DDR3 and integrated graphics. All systems running Windows® 7 Ultimate with DirectX 11.0. EMB-38

4 Calculation: AMD G-Series SOC FT3 BGA package dimension 24.5mm x 24.5mm = 600.25 mm2 SOC; AMD G-Series APU FT1 and Controller Hub two-chip platform: 19mm x 19mm + 23mm x 23mm = 890 mm2; 33% improvement. EMB-40

5 The low-power x86 microprocessor class includes: GX-420CA @ 25W TDP (scored 19); GX415GA @ 15W (25), GX217GA @ 15W (17), GX210HA @ 9W (20), G-T56N @ 18W (12), G-T52R @ 18W (7), G-T40N @9W (14), G-T16R @ 4.5W (19), Intel Atom N270 @ 2.5W (20), Intel Atom D525 @ 13W (9), Intel Atom D2700 @ 10W (12) & Intel Celeron G440 @ 35W (5). Performance score based on an average of scores from the following benchmarks: Sandra Engineering 2011 Dhrystone ALU, Sandra Engineering 2011 Whetstone iSSE3, 3DMark® 06 (1280 x 1024), PassMark Performance Test 7.0 2D Graphics Mark, and EEMBC CoreMark Multi-thread. All systems running Windows® 7 Ultimate for Sandra Engineering, 3DMark® 06 and Passmark. All systems running Ubuntu version 11.10 for EEMBC CoreMark. All configurations used DirectX 11.0. AMD G-Series APU system configurations used iBase MI958 motherboards with 4GB DDR3 and integrated graphics. All AMD G-Series SOC systems used AMD "Larne" Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D2700 was tested with Jetway NC9KDL-2700 motherboard, 4GB DDR3 and integrated graphics. Intel Celeron system configuration used MSI H61M-P23 motherboard with 4GB DDR3 and integrated graphics. Intel Atom N270 system configuration used MSI MS-9830 motherboard with maximum supported configuration of 1GB DDR2 (per http://download.intel.com/design/intarch/manuals/320436.pdf,) and Intel GM945 Intel Atom D525 used MSI MS-A923 motherboard with platform integrated 1GB DDR3 and integrated graphics. EMB-36
6 Calculation based on performance of GX-420GA GPU running at 600MHz = 0.6 GHz. 0.6 x 256 FLOPs = 153.6 GFLOPS. EMB-43

This document contains forward-looking statements concerning AMD, the timing and features of AMD's future products, the ability of AMD to win in embedded segments with new APU SOC products in 2013, the benefits from AMD's new technology partnerships and the timing of future products that incorporate AMD's products, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects," and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this document are based on current beliefs, assumptions and expectations, speak only as of the date of this document and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Risks include the possibility that Intel Corporation's pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities may negatively impact the company's plans; the company may be unable to develop, launch and ramp new products and technologies in the volumes that are required by the market at mature yields on a timely basis; that the company's third party foundry suppliers will be unable to transition its products to advanced manufacturing process technologies in a timely and effective way or to manufacture the company's products on a timely basis in sufficient quantities and using competitive technologies; the company will be unable to obtain sufficient manufacturing capacity or components to meet demand for its products or will not fully utilize its commitment with respect to GLOBALFOUNDRIES microprocessor manufacturing facilities; that customers stop buying the company's products or materially reduce their operations or demand for the company's products; that the company may be unable to maintain the level of investment in research and development that is required to remain competitive; that there may be unexpected variations in the market growth and demand for its products and technologies in light of the product mix that the company may have available at any particular time or a decline in demand; that the company will require additional funding and may be unable to raise sufficient capital on favorable terms, or at all; that global business and economic conditions will not improve or will worsen; that demand for computers will be lower than currently expected; and the effect of political or economic instability, domestically or internationally, on the company's sales or supply chain. Investors are urged to review in detail the risks and uncertainties in the company's Securities and Exchange Commission filings, including but not limited to the Annual Report on Form 10-K for the year ended December 29, 2012.

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By: Unknown On 5:56 PM

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TSMC narrows production of 16nm FinFET chips to late 2013, wants 10nm in 2015

For as often as TSMC has extolled the virtues of FinFET chip designs, we've been wondering exactly when we'd find them sitting in our devices. Thanks to competition from rival semiconductor firms, we'll get them relatively soon: the company now expects to produce its first wave of FinFET-based, 16-nanometer chips toward the end of 2013. While they won't be as nice as 14nm-XM chips in the pipeline, the 16nm parts should still offer battery life and speed improvements over the 28nm chips we know today. These improvements also won't be the end of the road -- TSMC anticipates 10nm designs built on extreme ultraviolet lithography late into 2015, and CEO Morris Chang believes there's seven or more years of advancements in manufacturing before Moore's Law starts breaking down. We'll just be happy if we see FinFET reach our phones and tablets in the near term.

Via: Phone Arena

Source: EETimes

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By: Unknown On 10:00 PM

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Physicists steer light on superconducting chips, forge our quantum computing future

We're still years away from quantum computing becoming an everyday reality, but the physics geniuses over at the University of California Santa Barbara have made a discovery that might speed that process along. A team under professor John Martinis' tutelage has developed a way to manipulate light on a superconducting chip at the quantum level, allowing the group to control the wave forms of released photons with a switch and a resonator. That might not seem like much, but it's ultimately a launching pad for much more. With photons now bowing to researchers' whims, the next step is to see if the particles can securely transfer data over long distances, such as between Earth and orbiting satellites, or just from one end of the world to another. It's a lofty goal to be sure, but nobody said the revolution would be over in a day.

Via: Phys.org

Source: Physical Review Letters

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By: Unknown On 6:49 PM

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Everspin throws first ST-MRAM chips down, launches commercial spin-torque memory era

Everspin debuts first Spin-Torque MRAM for high performance storage systems

MRAM leader sampling 64Mb DDR3 ST-MRAM; engaging with partners to prepare design and manufacturing ecosystems

CHANDLER, Ariz. – Nov. 12, 2012 – Everspin Technologies leads the industry in commercializing the first Spin-Torque Magnetoresistive RAM (ST-MRAM), a new type of high performance and ultra-low latency memory that is expected to transform storage architecture and help drive the continuous evolution of Moore's Law.

ST-MRAM is a performance-optimized Storage Class Memory (SCM) that bridges the role of today's conventional memory with the demands of tomorrow's storage systems by providing non-volatility, high endurance and ultra-low latency. The 64Mb device is the first product in Everspin's ST-MRAM roadmap that is planned to scale to gigabit density memories with faster speeds. Select customers are now evaluating samples of Everspin's EMD3D064M 64Mb DDR3
ST-MRAM.

"The properties of ST-MRAM are particularly appealing to the enterprise SSD market because of its ability to enhance and complement flash memory technology," said Joseph Unsworth, research vice president at Gartner. "The commercialization of this technology is an important industry milestone that should continue to drive SSD proliferation in data center and in-memory computing architectures."

The first semiconductor memory that combines the speed and endurance of DRAM with the non-volatility of Flash, ST-MRAM gives designers of high performance storage systems the ability to achieve ultra low latency, increase reliability with high cycling endurance and protect data in the event of power loss. One example of potential use is in the area of cloud storage-even as more users and content are added, faster and consistent data storage access is a necessity.

"Existing memory technologies face significant challenges to deliver the right balance of performance, power consumption, and reliability as they scale to smaller process geometries," said Jeff Janukowicz, research director for Solid State Storage and Enabling Technologies at IDC. "The commercialization of the first 64Mb Spin-Torque MRAM is an industry milestone along the path to broader use of more varied non-volatile memory technologies to improve storage device reliability, and to increase performance."

Everspin's proprietary Spin-Torque technology uses a spin-polarized current for switching. Data is stored as a magnetic state versus an electronic charge, providing a non-volatile memory bit that does not suffer wear-out or data retention issues associated with Flash technology. The EMD3D064M 64Mb STMRAM is functionally compatible with the industry standard JEDEC specification for the DDR3 interface, which delivers up to 1600 million transfers per second per I/O, translating to memory bandwidth of up to 3.2 GBytes/second at nanosecond class latency. The product is offered in an industry standard WBGA package aligned with the DDR3 standard.

"Data has transcended from being a buzzword to where it's an invaluable commodity. At the heart of the data revolution is the issue of how to store, manage and retain it securely, efficiently and cost-effectively. Our first ST-MRAM product has the potential to carry today's high performance storage systems to greater heights," said Phill LoPresti, president and CEO of Everspin Technologies. "We are collaborating with select customers to allow them to evaluate and take advantage of Spin-Torque MRAM technology sooner and to gather feedback that will help us finalize our 64Mb DDR3 ST-MRAM for production."

ST-MRAM gives system designers the benefit of persistent, high endurance storage or memory for applications that demand better reliability and that need the performance boost of DDR3 speed. The 64Mb density MRAM provides an ideal entry point for non-volatile buffer and cache memory in solid state and RAID storage systems as well as storage appliances. The 64Mb device will complement existing low cost memory technologies, reducing overall system cost and complexity.

ST-MRAM ecosystem

Everspin is manufacturing ST-MRAM on its 200mm production line in Chandler, Arizona and is collaborating with industry leaders to establish 300mm MRAM tools and additional fab capacity. Everspin is also working with design partners to ensure that the required tools and support are in place to drive the rapid adoption of ST-MRAM, including the necessary memory controllers, memory modules (DIMMs) and evaluation platforms.

Availability

Everspin is shipping working samples of the EMD3D064M 64Mb DDR3 STMRAM to select customers and will announce details on broad availability in 2013. In addition, Everspin is offering ST-MRAM non-volatile random access memory modules in industry standard configurations, and PCIe FPGA platforms are available now allowing customers to start designs. For more information, visit http://everspin.com/spinTorqueMRAM.php

About Everspin Technologies
Everspin Technologies is the leading developer and manufacturer of magnetic RAM (MRAM), offering stand-alone and embedded Toggle and Spin-Torque MRAM products. As the world's first volume MRAM supplier, Everspin has established itself as "The MRAM Company" with an intellectual property portfolio of more than 600 active patents and applications, many of which are fundamental and essential for MRAM technologies. Today Everspin delivers MRAM products to broad applications in the data center and storage, energy and infrastructure,
and automotive and transportation markets. www.everspin.com

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By: Dilusha On 10:05 PM

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Samsung's new 10nm-process 64GB mobile flash memory chips are smaller, faster, better

Samsung Introduces Advanced Memory Storage Solution for Slim Smartphones and Tablets
SEOUL, Korea on Nov. 15. 2012

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced a next-generation 64GB embedded multimedia card (eMMC) using 10 nanometer (nm)-class* process technology. The new 64Gb NAND memory went into production late last month.

Myungho Kim, vice president of Memory marketing, Device Solutions, Samsung Electronics noted, "The new high-speed, small form factor eMMC reinforces Samsung's technology leadership in storage memory solutions. We look forward to expanding our line-up of embedded memory solutions in conjunction with the new chip's design, in pursuing a system-level adoption of application processors and other key components that form the foundation for the most advanced mobile platforms. This will allow us to better attend to time-to-market demands enabling the design of more convenient features for next-generation mobile applications."

Embedded memory is the key memory component in popular mobile applications such as smartphones and tablets. Advanced high-performance, high-density eMMCs allow users to access high-density and high-resolution content such as full HD video on their latest mobile devices and provide a better user experience for web browsing, gaming and running rich applications.

Samsung is applying 64Gb high-performance NAND memory using its10nm-class technology to the new 64GB eMMC Pro Class 2000 memory solution. The new embedded memory solution exceeds the performance levels of the conventional 64GB eMMC Pro Class 1500 based on an eMMC 4.5 interface.

The new high-speed eMMC will be submitted next year to the industry standards body JEDEC, (Joint Electron Engineering Council) for adoption as an industry standard.

Samsung's next-generation 64GB eMMC Pro Class 2000 comes just five months after the company introduced its first embedded memory supporting the eMMC4.5 interface and delivers a 30 percent advantage in performance over that solution.

The 10nm-class technology based NAND also is process compatible to Samsung's advanced 20nm-class* 64Gb MLC NAND, which was first available last May, improving manufacturing productivity by 30 percent.

The new memory solution has a random write speed of 2,000 IOPS (input/output per second) and a random read speed of 5,000 IOPS. In addition, sequential read and write speeds are 260 megabytes per second (MB/s) and 50MB/s respectively, which is up to 10 times faster than a class 10 external memory card that reads at 24MB/s and writes at 12MB/s, greatly enhancing the smoothness of multitasking on mobile gadgets.

Current mobile applications show a distinctive trend to slimmer designs and larger display screens, while using advanced multi-core processors and high density (2 Gigabyte) LPDDR2 memory for higher performance, with larger batteries for longer usage on a single charge. This new chip accommodates the increasing size limitations of mobile form factors at the component level.

The 64GB eMMC Pro Class 2000 measures 11.5mm by 13mm, which represents a 20 percent reduction in size over the conventional embedded memory form factor (12mm by 16mm).

For more information about Samsung memory, visit: www.samsungsemi.com or www.samsung.com/memory

###

Samsung and the stylized Samsung design are trademarks and service marks of Samsung Electronics Co., Ltd. Other trademarks are the property of their respective owners.

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By: Dilusha On 8:58 PM

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