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Friday, April 12, 2013

China UnionPay and Intel join forces for secure mobile payment

Intel Developer Forum in Beijing: Day Two

April 11, 2013 - During their keynotes at the Intel Developer Forum in Beijing today, Doug Fisher, vice president and general manager, Intel Systems Software Division, and Justin Rattner, chief technology officer, discussed how Intel Corporation is modernizing computing to deliver amazing new experiences to users. Here are brief summaries and the news disclosed during the keynotes.

Doug Fisher, "Intel's Vision for Developers"
Vice President and General Manager, Systems Software Division

Doug Fisher, vice president and general manager of Intel's System Software Division, opened the second day of IDF, addressing several myths surrounding the industry and providing a vision of the vast opportunities that await developers. Specifically, he showcased Intel's transformation of the PC experience and advances in device segments, support of multiple operating environments, and efforts to help developers scale and modernize computing with new hardware features and software advancements for more compelling user experiences. He discussed how developers can incorporate touch and sensor interfaces to modernize applications, and use perceptual compute technologies to enable consumers to interact with PCs via voice control, gesture recognition, and more.

Intel® HTML5 Development Environment: Intel strongly supports and actively invests in HTML5 to ensure this development platform continues to evolve and remain open to innovation, while also helping application developers lower total cost and improve time-to-market for cross-platform application development and deployment. Based on Web standards and supported by W3C, HTML5 enables software developers to create applications once and deploy across multiple platforms with the potential to reach billions of devices, users and customers -- a feat that is difficult to achieve due to the fragmented operating system environment.

Fisher introduced the Intel® HTML5 Development Environment to make HTML5 development accessible to all developers. The solution provides a front-to-back and integrated cross-platform development environment to develop, test and deploy applications for multiple operating systems including iOS*, Android*, Windows* 8 and Windows Phone 8. The Intel HTML5 Development Environment assists developers deploy applications through multiple application stores including Amazon* Appstore, Apple* App Store, Facebook*, Google Chrome Web Store, Google* Play Store and Windows* Phone Store. The Intel HTML5 Development Environment is available to developers from the HTML5 zone on Intel® Developer Zone with no license or usage fees.

UnionPay Announces Cooperation with Intel in Mobile Payments: Using complex technologies including near field communications (NFC), mobile payments and Intel® Identity Protection Technology, Intel has collaborated with a global bankcard network UnionPay, to make mobile payments both easy and secure. Speaking during Fisher's keynote, Hongfeng Chai, executive vice president of UnionPay, introduced the UnionPay Quick Pass service in which consumers can use a NFC smartphone powered by the Intel processor to pay for products everywhere from department stores to vending machines.

Justin Rattner, "Architecting the Future of Computing"
Chief Technology Officer

Intel Chief Technology Officer, Justin Rattner, took the stage to discuss how Intel Labs is drawing up plans for a bright future. He revealed a vision for connected and sustainable cities where information technology helps to address challenges of clean air, clean water, better health and improved safety. He explained how today's mobile, urban lifestyle is demanding faster and cheaper wireless broadband communications. Forecasting a move beyond the information age, Rattner described a new era coined "the data society" and showed how information in the cloud will work on everyone's behalf, collaboratively and safely, by analyzing and relating different data to deliver new value to individuals, enterprises and society as a whole.

Silicon Photonics: Today, Rattner demonstrated for the first time publicly a fully functional silicon photonics module incorporating Intel® Silicon Photonics Technology (SPT) and operating at 100 gigabits per second (Gbps). This is a completely integrated module that includes silicon modulators, detectors, waveguides and circuitry. Intel believes this is the only module in the world that uses a hybrid silicon laser. The demonstration was made via a video during Rattner's keynote.

In addition to the Intel SPT module, Rattner showed the new photonics cable and connector that Intel is developing with Corning. This new connector has fewer moving parts, is less susceptible to dust and costs less than other photonics connectors. Intel and Corning intend to make this new cable and connector an industry standard. Rattner said the connector can carry 1.6 terabits of information per second.

Intel Developer Forum

IDF spans the worlds of mobility, digital enterprise, digital home, and technology and research. Held at the China National Convention Center on April 10-11, the event is geared toward the Chinese market in support of local innovation and Intel's industry leadership in the region. Next up on the IDF schedule is a 3-day event in San Francisco, which will be held Sept. 10-12 at Moscone Center West. Further information is available at www.intel.com/idf.

Source

By: Unknown On 10:34 AM

Wednesday, January 2, 2013

CTIA and MobileCon join forces in an attempt to out do Mobile World Congress

Every year, we in the mobile industry look forward to a handful of events. The Consumer Electronics Show is in January, Mobile World Congress is in February, in April or May there’s Google I/O, the month after that is Apple’s Worldwide Developers Conference, Germany hosts IFA in either late August or early September, Apple announces a new phone in October or November, and right after that we get a new Nexus device and a new version of Android.

Notice anything missing from the list above? CTIA and MobileCon, two shows held in America that are typically so low profile that most websites either don’t bother showing up or they just send one person.

The people organizing said two events want to change that. They’re going to merge both shows and call it the “Super Mobile Show”. No, we’re not making that up. The first SMS is going to take place in September 2014 at the at the Sands Expo Convention Center in Las Vegas, Nevada.

Will it be a big deal? It’s far too early to tell at this point. Most companies are starting to realize that it’s better to host their own events as opposed to attending one of these supersized conventions. Trust us when we tell you that big events like CES can scar a journalist for life. You don’t sleep for three days, your inbox explodes from all the press releases you get, and you’re guaranteed to catch a nasty cold that renders you useless for at least a week.

Does the world need another big wireless trade show? That’s debatable. Mobile World Congress is a pain for Americans because it’s in Europe, and CES is a pain for Europeans, so that’s why they host IFA during the summer. We’re not exactly sure what gap SMS is trying to fill, but we will keep an eye on it just in case something major happens.

SOURCES Engadget

TAGS CTIAMobile World CongressMobileCon

Stefan has been writing about the mobile phone industry since November 2006, and he even worked at Nokia in 2008 and 2009. He's owned every Nexus device to date, which is a fancy way of saying he dislikes skins. Follow him on Twitter (@WhatTheBit), but be prepared, he complains about the weather a lot.

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By: Dilusha On 9:25 PM

Saturday, December 22, 2012

Killjoy Apple sinks Kickstarter project, forces $140,000 donation refund

A victim of Apple

It's a story of David vs Goliath, but in this version Goliath has rather cruelly crushed little David.

Apple has closed down a Kickstarter project by refusing to licence its Lightning charger. So now the POP portable charging station won't see the light of day, and the technology and design lab behind it has to return the $139,170 in funding it received on the crowd-sourcing website.

The POP was going to be a portable charger that let you juice up your Apple device, among other phones and tablets. Apple, not happy with its iPhones and iPads sharing the stage with rivals, didn't licence its Lightning dock, and so the team have had to abandon the project.

The team at Edison Junior, the company behind the POP, are understandably annoyed, and aren't shy about letting it be known. "We are pissed," CEO Jamie Siminoff told VentureBeat. "I think they are being a bunch of assholes, and I think they're hurting they're customers."

Edison Junior will have to foot the fees from credit cards as well as the Kickstarter charges. In total, that amounts to more than $11,000.

"We would have loved to have made the product," Siminoff said. "At the same time I feel like we're making the correct decision… I'm not willing to compromise on the product."

He guaranteed all backers would get their donations back in full.

And he had a word of warning for Apple over its business practices. "When you do things that are bad for the customer… I think it will be bad for them," he said.

Via VentureBeat